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Patent AT-E401766-T1: [Translated] MULTI-LAYER METALIZED COMPOSITE ON POLYMER FILM PRODUCT AND METHOD

Published by National Center for Biotechnology Information (NCBI) | U.S. Department of Health & Human Services | Metadata Last Checked: September 06, 2025 | Last Modified: 2025-09-06
A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.

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