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Patent AT-E400395-T1: [Translated] SOLDER PASTES
A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5 - 10.0 wt% of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01 - 10.0 wt% of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.
Complete Metadata
| bureauCode |
[ "009:25" ] |
|---|---|
| identifier | https://healthdata.gov/api/views/t2aq-9stu |
| issued | 2025-09-05 |
| landingPage | https://healthdata.gov/d/t2aq-9stu |
| programCode |
[ "009:066" ] |
| theme |
[ "NIH" ] |
