Data for Advanced Metrology Suite for Linking Residual Stress to FundamentalProperties of Thermoset Packaging Materials

Published by National Institute of Standards and Technology | National Institute of Standards and Technology | Metadata Last Checked: July 14, 2025 | Last Modified: 2025-01-30 00:00:00

This repository contains data generated to support and ECTC 2025 conference manuscript titled "Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials". It contains differential scanning calorimetry (DSC), rheology, digital image correlation (DIC), vapor uptake, and stress bench data on and example commercially available encapsulant epoxy material. The goal of the study and data is to (a) demonstrate these techniques, and (b) better understand the cure kinetics, liquid-to-solid transition, and residual stresses in for this material system. More complete descriptions of the methods and finding are available in the associated manuscript.The dataset contain about 2.5 GB of data, most of which by size is DIC images in .7z compressed folders. Most data is provided in .csv, .xslx, and .mat files. Resultant figures are included for reference in .png, .tiff or similar formats.

Find Related Datasets

Click any tag below to search for similar datasets

Complete Metadata

bureauCode	[ "006:55" ]
identifier	ark:/88434/mds2-3698
issued	2025-02-06
landingPage	https://data.nist.gov/od/id/mds2-3698
language	[ "en" ]
programCode	[ "006:045" ]
theme	[ "Materials:Materials characterization", "Materials:Polymers", "Metrology:Flow metrology and rheology", "Metrology:Optical, photometry, and laser metrology" ]