Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan

Published by National Institute of Standards and Technology | National Institute of Standards and Technology | Metadata Last Checked: June 27, 2025 | Last Modified: 2023-03-01 00:00:00

The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225

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Complete Metadata

bureauCode	[ "006:55" ]
identifier	ark:/88434/mds2-2948
issued	2023-03-10
landingPage	https://data.nist.gov/od/id/mds2-2948
language	[ "en" ]
programCode	[ "006:045" ]
references	[ "https://doi.org/10.1109/ECTC51909.2023.00225" ]
theme	[ "Chemistry:Analytical chemistry", "Chemistry:Chemical engineering and processing", "Chemistry:Thermochemical properties", "Materials:Composites", "Materials:Materials characterization", "Materials:Polymers" ]